Moving Research into Practical Packaging Applications
Transitioning innovative materials from the laboratory to real-world industrial application is a critical step in the development of sustainable food packaging. A central focus of this transition involves replacing traditional per- and polyfluoroalkyl substances (PFAS) with safer, environmentally friendly alternatives that maintain high performance standards.
Through the European BIO-SUSHY project, research partners are actively investigating scalable application methods to evaluate how bio-based, PFAS-free coatings perform under practical processing conditions.
Electrostatic Powder Coating with Lignin-Based Materials
One key process being explored involves the electrostatic deposition of lignin-based thermoplastic powder coatings onto paperboard substrates. Facilitated by project partner Wood K plus (Kompetenzzentrum Holz GmbH), this technique applies dry coating particles using an electrostatic charge, creating a uniform layer that is subsequently thermal-cured.
The primary goals of this application process include:
Barrier Enhancement: Developing robust resistance against water and grease penetration for fiber-based packaging.
Process Compatibility: Testing whether dry powder coating methods can integrate efficiently with existing packaging manufacturing lines.
Scalability Evaluation: Assessing the technical feasibility and resource efficiency of moving from pilot-scale experiments to high-volume industrial production.
Evaluating Industrial Exploitation Potential
Developing sustainable packaging materials requires a dual focus on chemical formulation and manufacturing viability. By demonstrating the physical application of lignin-based coatings on standard paperboard, the BIO-SUSHY project aims to establish clear pathways for future exploitation within the food packaging sector.
Watch the demonstration video below to observe the electrostatic powder coating process in action and learn more about the technical steps shaping the future of PFAS-free food packaging.
